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Tecbond Polyamide (PA) Hot Melt Adhesives

Tecbond Polyamide (PA) Hot Melt Adhesives
Tecbond Polyamide based hot melt adhesives are a higher performance polymer that is used where better resistance to temperature extremes and good chemical resistance is required. Tecbond polyamide hot melt adhesives, typical Tecbond 7784 and Tecbond 7785 provides a tough flexible adhesive that exhibits excellent adhesion to many difficult to bond substrates.
Aluminium, Nylon, ABS, PVC, Polypropylene, Steel, Glass, wood veneer, melamine, Ceramics, Polyethylene, Vacuum foamed mouldings, Acrylic, GRP, Polycarbonate, Rigid PVC, Fabrics, Geo-Fabric, LDPE, HDPE, Stainless steel and the list goes on.
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Tecbond 7786 FR is a polyamide adhesive that has a ULVO flammability rating and excellent electrical properties. It is a good general purpose adhesive that can be used for component stabilisation, wire attachment and potting applications. It will give good adhesion to PVC and other plastics as well as PC board. TECBOND 7786FR also provides excellent upper and lower heat resistance.
Tecbond Polyamide hot melt adhesives typical provide a temperature range from -60c to +130c offering good low and high resistance. Outside of this range Tecbond Polyamide hot melt adhesives which are thermoplastic and consequently will become more brittle at low temperatures (Below -60c) and softer at higher temperatures (Above +130c). Because of the thermoplastic nature of hot melts, the strength of a bond will vary with both the amount and rate of load at different temperatures.
Over recent years, developments in hot melt adhesives have allowed many product assembly applications to benefit from the efficiencies of Tecbond Polyamide hot melt adhesives.
Tecbond Polyamide hot melt adhesives the bond strength will vary with the amount of adhesive applied. Larger amounts of adhesive cover a larger area and so increase overall strength. Additionally, larger amounts of adhesive conserve heat and consequently the adhesive tends to be at a higher temperature when parts are brought together. This also increases bond strength !

Once Tecbond Polyamide hot melt adhesives have been applied, they start to cool. If the assembly is not completed quickly enough, then the bond strength will suffer as the adhesive will have cooled to a point where a strong bond cannot be achieved. This is known as a cold bond and although initial results look acceptable, the bond can deteriorate over a 24-hour period to an unacceptable level.

Take a look at our range of Tecbond Polyamide Hot Melt Adhesives