Tecbond LM41 Low Melt adhesive is a game-changer, especially for applications where heat-sensitive materials are being used. The innovative low melt adhesive formulation has a lower melting point (130°), allowing for exceptional bonding without compromising on strength and durability.
Traditional hot melts are applied between 195°C and 215°C, whereas Tecbond LM41 low melt adhesive is designed to be applied at temperatures around 130°C and predominantly used in scenarios where a regular hot melt would damage the substrate to which it is trying to bond. Materials that are particularly susceptible to damage from hot melts include expanded polystyrene, packing foams, plastic films, floristry oasis, and some light fabrics.
See customer video of Tecbond LM41 low melt adhesive being used to make a polystyrene battery storage unit. What can we glue for you?
Arrange a technical visit, demonstration or a sample pack and see what you can glue with Tecbond LM41 low melt adhesive. Call: 0161 627 1001 or email: sales@gluegunsdirect.com
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