Tecbond LM41Low Melt Adhesive – The Safer Way to Bond Heat-Sensitive Substrates
Tecbond LM41 Low Melt adhesive is a game-changer, especially for applications where heat-sensitive materials are being used. The innovative low melt adhesive formulation has a lower melting point (130°), allowing for exceptional bonding without compromising on strength and durability. Traditional hot melts are applied between 195°C and 215°C, whereas Tecbond LM41 low melt adhesive is […]
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