Tecbond 7784 is a tough flexible polyamide based adhesive that exhibits excellent adhesion to many difficult to bond substrates. Suitable for product assembly, woodworking and packaging applications that require both high and low heat resistance.
Please note: Tecbond 7784 is a polyamide based product and will consequently absorb small amounts of moisture from the atmosphere. This does not affect the performance of the adhesive, however, even a small amount of moisture contamination will turn into a large amount of steam at glue gun temperature. This will cause the glue gun to drip, foam and the glue stick to back up. Please keep the adhesive sealed in the special packs provided. Moisture contaminated adhesive may be dried in an oven at 70c for 24-48 hours.
All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).
For use with all Tec 43mm glue guns.
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Important: Hot Melt Adhesives do have limitations! Being a thermoplastic product hot melt adhesives soften with heat and return to a solid state by the loss of heat. With this in mind, standard hot melt adhesives are not recommend for applications subjected to heat or direct sunlight. However we do offer grades with high heat resistance. Water and hot melt adhesives are a bad combination – standard hot melt adhesives are not waterproof and should be avoided for external applications. On saying this, we do have PUR adhesives that can be use externally and can even be dry cleaned. We strongly recommend that you thoroughly test the product and satisfy yourselves that the product is suitable for your application. This product suggested uses are a generalised suggestion and other factors may play a role in achieving the required bond, e.g. heat resistance, chemical resistance, gap filling, surface area to glue, open time or a degree of glue flexibility may be required etc.
Please contact our technical team on 0161 627 1001 to discuss your application in further detail.
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