TECBOND 803-PL is a peelable adhesive for credit card attachment, magazine tip ins, removable labels, promotional items give always bonded to most packaging.
Tecbond 803-PL is ideally suited to applications which are cost sensitive and where some staining of the substrates is acceptable.
Formulated for clean machine running with low char and low stringing characteristics.
Methods of application
Bulk hotmelt tank, Spray and jet application, Tec 4500 Bead or Spray glue guns
Suggested application temperature
Suggested application temperature is 150-170ºC / 302-338ºF depending on substrates to be bonded.
F.D.A approved. All the constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (Adhesives).