TECBOND 7786FR is a very high temperature fire retardant polyamide adhesive suitable for product assembly applications in the electronics industry, available in amber.
It provides strong bonds on many materials including plastics like PVC and ABS, light gauge metals and PC board. TECBOND 7786FR has good upper and lower heat resistance and excellent electrical properties. TECBOND 7786FR is a fire retardant adhesive.
All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).
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Important: Hot Melt Adhesives do have limitations! Being a thermoplastic product hot melt adhesives soften with heat and return to a solid state by the loss of heat. With this in mind, standard hot melt adhesives are not recommend for applications subjected to heat or direct sunlight. However we do offer grades with high heat resistance. Water and hot melt adhesives are a bad combination – standard hot melt adhesives are not waterproof and should be avoided for external applications. On saying this, we do have PUR adhesives that can be use externally and can even be dry cleaned. We strongly recommend that you thoroughly test the product and satisfy yourselves that the product is suitable for your application. This product suggested uses are a generalised suggestion and other factors may play a role in achieving the required bond, e.g. heat resistance, chemical resistance, gap filling, surface area to glue, open time or a degree of glue flexibility may be required etc.
Please contact our technical team on 0161 627 1001 to discuss your application in further detail.