TECBOND 7718 is a Low viscosity fire retardant polyamide for potting and encapsulating applications in the electronics industry. Tecbond 7718 has a very low viscosity that sets very hard. It is suitable for potting and encapsulation in the electronics industry. Available in amber and black.
Potting and Encapsulation: Tecbond 7718 has been tested for use in electrical / electronic applications and the electrical characteristics are listed below. TECBOND 7718 is fire retardant and would meet the UL-V0 flammability rating. The use of hotmelt speeds up assembly as there is no mixing and any unused adhesive remains in the glue gun ready for next time, so there is no waste. Setting time is usually less than 2 minutes. Coloured versions of the adhesive are available which can be useful to hide components or colour code for traceability.
Knot filling / Wood repair
The flow characteristics, hard setting and low shrinkage nature of the Tecbond 7718 make it idea for filling cracks and voids often found around knots in many types of wood. The adhesive is applied by glue gun, trimmed with a sharp knife or chisel and then sanded as usual before finishing. The adhesive is available in different colours to match the wood. For applications where a tougher, hard wearing product is required e.g repairing laminate flooring.
Please note: Tecbond 7718 is a polyamide based product and will consequently absorb small amounts of moisture from the atmosphere. This does not affect the performance of the adhesive, however, even a small amount of moisture contamination will turn into a large amount of steam at glue gun temperature. This will cause the glue gun to drip, foam and the glue stick to back up. Please keep the adhesive sealed in the special packs provided. Moisture contaminated adhesive may be dried in an oven at 70c for 24-48 hours.
All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).
For use with all Tec 12mm glue guns.
- Best joint designs for hot melt gluing
- What is a cold bond ?
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- What is a Hot Melt Adhesive?
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- Hot Melt fumes
Important: Hot Melt Adhesives do have limitations! Being a thermoplastic product hot melt adhesives soften with heat and return to a solid state by the loss of heat. With this in mind, standard hot melt adhesives are not recommend for applications subjected to heat or direct sunlight. However we do offer grades with high heat resistance. Water and hot melt adhesives are a bad combination – standard hot melt adhesives are not waterproof and should be avoided for external applications. On saying this, we do have PUR adhesives that can be use externally and can even be dry cleaned. We strongly recommend that you thoroughly test the product and satisfy yourselves that the product is suitable for your application. This product suggested uses are a generalised suggestion and other factors may play a role in achieving the required bond, e.g. heat resistance, chemical resistance, gap filling, surface area to glue, open time or a degree of glue flexibility may be required etc.
Please contact our technical team on 0161 627 1001 to discuss your application in further detail.