Tecbond LM44 low melt adhesive has been replaced by Tecbond LM41
The upgraded version, Tecbond LM41 low melt adhesive has been launched to the market and delivers the perfect bond. Tecbond LM41 is suitable for use on temperature sensitive materials that would be damaged by normal hotmelt temperatures, such as foams, thin films, and expanded polystyrene. The lower application temperature (130-160˚C) reduces the risk of accidental […]
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