Description
Tecbond LM44 is a white high performance adhesive formulated for application at low temperatures (130-160°C). It is suitable for use on temperature sensitive materials that would be damaged by normal hot melt adhesives.
This fast setting adhesive can also be used for carton closing and other applications involving paper, board, wood, GRP, aluminium and some plastics. It is also useful for expanded polystyrene and polyethylene foam assembly, as the low application temperature prevents thermal damage distortion.
The low application temperature minimises the risk of burns, so it is particularly suitable for assembling small items where fingers work very close to the molten adhesive. It is suitable for schools and colleges as the risk of accidental burns are greatly reduced.
All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).
For use with all Tec 12mm glue guns.
- Best joint designs for hot melt gluing
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Important: Hot Melt Adhesives do have limitations! Being a thermoplastic product hot melt adhesives soften with heat and return to a solid state by the loss of heat. With this in mind, standard hot melt adhesives are not recommend for applications subjected to heat or direct sunlight. However we do offer grades with high heat resistance. Water and hot melt adhesives are a bad combination – standard hot melt adhesives are not waterproof and should be avoided for external applications. On saying this, we do have PUR adhesives that can be use externally and can even be dry cleaned. We strongly recommend that you thoroughly test the product and satisfy yourselves that the product is suitable for your application. This product suggested uses are a generalised suggestion and other factors may play a role in achieving the required bond, e.g. heat resistance, chemical resistance, gap filling, surface area to glue, open time or a degree of glue flexibility may be required etc.
Please contact our technical team on 0161 627 1001 to discuss your application in further detail.
